RD50-MPW4: a thin backside-biased High Voltage CMOS pixel chip for high radiation tolerance

Open Access
Authors
  • E. Vilella
  • T. Bergauer
  • R. Casanova
  • H. Handerkas
  • C. Irmler
  • U. Kraemer
  • I. Mandić
  • R. Marco-Hernández
  • J. Mazorra de Cos
  • F.R. Palomo
  • B. Pilsl
  • S. Powell
  • P. Sieberer
  • J. Sonneveld
  • H. Steininger
  • C. Zhang
  • S. Zhang
  • CERN-RD50 collaboration
Publication date 03-2025
Journal Journal of Instrumentation
Event Topical Workshop on Electronics for Particle Physics
Article number C03044
Volume | Issue number 20 | 3
Number of pages 7
Organisations
  • Faculty of Science (FNWI) - Institute of Physics (IoP) - Institute for High Energy Physics (IHEF)
Abstract
The RD50-MPW prototypes are High Voltage-CMOS (HV-CMOS) pixel chips in the 150 nm technology from LFoundry S.r.l. aimed at developing monolithic silicon sensors with excellent radiation tolerance, fast timing resolution and high granularity for tracking applications in future challenging experiments in physics. RD50-MPW4, the latest prototype within this programme, implements significant improvements for a high breakdown voltage (> 400 V), and therefore an excellent radiation tolerance, through a multi-ring structure around the chip edge and substrate backside-biasing to high voltage. Fabricated samples have been irradiated with neutrons up to 1016 neq/cm2 high fluence. Measured current-to-voltage characteristics and pixel equalisation with trimming Digital-to-Analogue Circuits (DACs), to prepare for a test beam with irradiated samples, are presented.
Document type Article
Note In special section: Topical Workshop on Electronics for Particle Physics, University of Glasgow, Scotland, U.K., 30 September–4 October 2024
Language English
Published at https://doi.org/10.1088/1748-0221/20/03/C03044
Downloads
Vilella_2025_J._Inst._20_C03044 (Final published version)
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